Capacitive Sensor Packaging

ABSTRACT

An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application No.61/649,217, filed May 18, 2012, entitled “Capacitive Sensor Packaging,”and U.S. Provisional Application No. 61/666,607, filed Jun. 29, 2012,entitled “Capacitive Sensor Packaging,” the entirety of which isincorporated by reference herein.

BACKGROUND

1. Field of the Disclosure

This application generally relates to circuits and packaging forfingerprint sensors.

2. Background of the Disclosure

Capacitive sensing of fingerprints provides for collection offingerprint information in response to distinct measures of capacitancebetween, on the one hand, one or more capacitive plates in a fingerprintrecognition sensor, and on the other hand, ridges and valleys of auser's finger (such as the epidermis of the user's finger, or possibly,subdermal layers of the user's finger).

It sometimes occurs that measurements of capacitance involveintroduction of electric charge on the epidermis of the user's finger.This can have the effect that only a small amount of charge can beintroduced without the user feeling the charge, sometimes as a tinglingor other noticeable effect on the epidermis of the user's finger.

It sometimes occurs that measurements of capacitance involve relativelysmall differences in capacitance between, on the one hand, thecapacitive plates of the fingerprint recognition sensor, and on theother hand, the ridges and valleys of the user's finger. For example,this would involve placing the user's finger as close as possible to thecapacitive plates. This can have the effect of limiting the designflexibility for the fingerprint recognition sensor.

It sometimes occurs that measurements of capacitance involve positioningof the user's finger with respect to the fingerprint recognition sensor.For example, the user's finger might have to be placed within aconductive ring, significantly limiting the size and position of thefingerprint recognition sensor. This can also have the effect oflimiting the design flexibility for the fingerprint recognition sensor.

It sometimes occurs that measurements of capacitance involve capacitivecoupling with a portion of the user's finger other than the epidermis.For example, capacitive coupling (or other fingerprint recognitionsensing) might involve as a subdermal layer of the user's finger. Thismight involve introduction of a relatively greater electric charge toconduct that capacitive coupling. As described in part above, this canhave the effect that the user might feel the charge, sometimes as atingling or other noticeable effect in a portion of the user's finger.

Each of these examples, as well as other possible considerations, cancause difficulty for the fingerprint recognition sensor, and for thedevice incorporating the fingerprint recognition sensor (such as acomputing device using fingerprint recognition for authentication). Thefingerprint recognition sensor might be limited in size, or position, orin whether it can be relatively easily incorporated with other elementsof the device incorporating the fingerprint recognition sensor. For afirst example, this can have the effect that the fingerprint recognitionsensor might not be easily incorporated into some types of devices (suchas relatively small devices like smartphones and touchpads). For asecond example, this can have the effect that the fingerprintrecognition sensor might be required to be relatively fragile orotherwise subject to unwanted design constraints.

SUMMARY

This application provides techniques, including circuits and designs,which can receive information with respect to fingerprint images, andwhich can be incorporated into devices using fingerprint recognition.For example, the fingerprint sensor can be disposed beneath a controlbutton or display element, for fingerprint recognition andauthentication while the device is being operated by a user.

In one embodiment, techniques include providing a fingerprintrecognition sensor disposed underneath other elements, but which isstill disposed relatively close to the user's finger when fingerprintrecognition is conducted. Circuits can be disposed underneath a buttonor underneath a display element, but with reduced amount of distancebetween one or more capacitive plates and the user's finger. For someexamples, circuits can be disposed underneath a device element, with thefingerprint recognition sensor circuit itself having reduced verticalspacing by one or more of (1) coupling the fingerprint recognitionsensor circuit using bonding wires disposed through one or more vias cutthrough a silicon wafer from the top of the circuit, (2) coupling thefingerprint recognition sensor circuit using bonding wires disposedthrough one or more trenches cut through a silicon wafer from an edge ofthe circuit, (3) encapsulating the fingerprint recognition sensorcircuit in plastic molding which is at least partially removed, and (4)coupling the fingerprint recognition sensor circuit to other circuitsusing solder elements, such as encapsulated solder balls or compressedsolder elements.

In one embodiment, circuits may embody or employ techniques which useelements of the device to aid the fingerprint recognition sensor infingerprint recognition. For some examples, circuits can be disposedusing one or more device elements, with the one or more device elementsassisting the fingerprint recognition sensor circuit by one or more of(1) coupling capacitive elements to a side of the device or near abutton or other device element, (2) printing circuit elements to assistthe fingerprint recognition sensor, or included in the fingerprintrecognition sensor, on an underside of a button or other device element,(3) coupling fingerprint recognition sensor circuit elements to a buttonor other device element which improves coupling an electric field of thefingerprint recognition sensor, such as an anisotropic element includingsapphire or another substance, and (4) using a transparent ortranslucent button or other device element to perform optical sensing orinfrared sensing in addition to capacitive sensing, to assist or beincluded in the fingerprint recognition sensor circuit.

In one embodiment, circuits include techniques which use elements of thedevice including the fingerprint recognition sensor circuit to assistthe user when using the fingerprint recognition sensor. For someexamples, circuits can be disposed using a device element, with thedevice element being disposed to assist the user by one or more of (1)using a recessed shape formed at least in part by a button or otherdevice element to help position the user's finger for fingerprintrecognition when using the fingerprint recognition sensor circuit, anddisposing the fingerprint recognition circuit underneath the button orother device element, and (2) disposing the fingerprint recognitioncircuit over a touch-responsive push button to provide tactile feedback.

While multiple embodiments are disclosed, including variations thereof,still other embodiments of the present disclosure will become apparentto those skilled in the art from the following detailed description,which shows and describes illustrative embodiments of the disclosure. Aswill be realized, the disclosure is capable of modifications in variousobvious aspects, all without departing from the spirit and scope of thepresent disclosure. Accordingly, the drawings and detailed descriptionare to be regarded as illustrative in nature and not restrictive.

BRIEF DESCRIPTION OF THE DRAWINGS

While the specification concludes with claims particularly pointing outand distinctly claiming the subject matter that is regarded as formingthe present disclosure, it is believed that the disclosure will bebetter understood from the following description taken in conjunctionwith the accompanying Figures, in which:

FIG. 1 shows a conceptual drawing of a fingerprint recognition sensorincluded in a portion of a device.

FIG. 2 shows a conceptual drawing of a button assembly, showing thelaminated layers, as partially described with respect to FIG. 1.

FIG. 3 shows another conceptual drawing of a button assembly, showingthe fingerprint recognition sensor, as partially described with respectto FIG. 1.

FIGS. 4A and 4B show another conceptual drawing of a button assembly,showing the fingerprint recognition sensor, as partially described withrespect to FIG. 1.

FIG. 5 shows a conceptual drawing of a device with button assembly,showing the fingerprint recognition sensor, as partially described withrespect to FIG. 1.

FIG. 6 shows another conceptual drawing of a button assembly, in arecessed design with a flat lens.

FIG. 7 generally shows a sample crystal lattice structure 700 forsapphire.

DETAILED DESCRIPTION

This disclosure is directed to fingerprint sensor systems for electronicdevices, including, but not limited to, fingerprint image sensors forsmartphones (or smart phones), tablet computers, media players, personalcomputers, and other portable electronics and mobile devices. In somedesigns, the fingerprint sensor is disposed beneath a control button ordisplay element, so that fingerprint recognition and authentication canbe performed while the device is being operated by a user.

The fingerprint sensor itself may utilize a grid of capacitive elementsfor capturing the fingerprint image, or an optical sensor or othersuitable fingerprint imaging technology. A control circuit can also beprovided, for example a control button or switch element responsive totouch or pressure, or a touchscreen control system responsive toproximity and (multiple) touch positioning. In some designs, thefingerprint sensor is utilized in combination with a control button ordisplay element formed with an anisotropic dielectric material, such assapphire.

The examples and embodiments described herein generally disclose variousstructures and methods for packaging a sensor, such as a capacitivesensor. Some embodiments incorporate various placements of the sensor,structure surrounding a sensor, connection structures (electrical,physical, or both), and techniques for enhanced sensor imaging, sensorretention, and guiding a user's finger to a proper location above asensor, where the sensor itself cannot be seen.

Additional examples and embodiments describe placement of the sensorwith respect to the device, for example a sapphire button or lenselement disposed in a recess in a cover glass or frame structure. Inother examples, the sensor may be embedded into an (e.g., laminated)cover glass system, or within the structure or housing of the device.The device housing or frame may also include an opening or sensoraperture in which the sensor is placed, with plastic or another materialmolded above the sensor, for example using an encapsulated sensordesign. The over-molded or encapsulating material may form part of thelens or button structure, or a sapphire material may be used.

FIG. 1

FIG. 1 shows a conceptual drawing of a fingerprint recognition sensor102 included in a portion of a device 100.

An exploded view figure of a portion of a device 100 shows an assemblyof parts disposed to form the fingerprint recognition sensor 102 circuitand position the sensor 102 circuit below a push button. While thisapplication describes a particular assembly with a particular pushbutton and a particular sensor 102 circuit, in the context of theinvention, there is no particular requirement for any such limitation.For example, the push button might be disposed somewhat off-center fromthe fingerprint recognition sensor 102 circuit, with the effect that thepush button is still effective for its purpose, while the sensor 102circuit still operates in conjunction with positioning of the user'sfinger nearby. After reading this application, those skilled in the artwould recognize that many other and further example assemblies would bewithin the scope and spirit of the invention, would be workable, andwould not require further invention or undue experiment.

A cover glass (CG) frame 106 is disposed to be coupled to a cover glass107 of a smartphone, touchpad, portion of a mobile computing device,input mechanism, key of a keyboard, portion of an input or output devicehousing, panel or body of a vehicle, appliance or the like, touch screenor other device 100, and disposed to be coupled to a frame of the device100. (In many embodiments, the device 100 is some form of mobilecomputing device.) The cover glass frame 106 includes a button hole 108disposed to position a push button, and also includes one or more screwholders 110 disposed to be matched to external screw locations anddisposed to receive horizontal screws for holding the cover glass frame106 in place at a base plate (as further described below) when theassembly is constructed.

The button hole 108 in the cover glass frame 106 is disposed to hold abutton 104 (which can form a top element of a push button, as describedbelow), as shown in the figure. The button 104 is disposed to fit intothe button hole 108. The button 104 includes a lens 112, at least aportion of the lens 112 helping to form a recessed shape, with theeffect of guiding the user's finger onto the button 104. The recessedshape may likewise be at least partially formed by a chamfer in theground ring. In one embodiment, the button 104 can be made of one ormore of the following materials, or equivalents thereof: aluminum oxide,glass or chemically treated glass, sapphire, a chemically treatedcompound having at least some characteristics thereof, or anothercompound having similar properties. The lens 112 is disposed within aground ring 114. In one embodiment, the ground ring 114 can be used toshield electromagnetic effects, with the effect of providing capacitanceisolation or other electromagnetic isolation. The ground ring 114 isshown in the figure as having a cylindrical edge which holds the lens112, and a base plate which can be aligned or oriented within the device100 when the assembly is constructed.

The button 104 is disposed above and coupled to a fingerprintrecognition sensor 102 circuit. In one embodiment, the fingerprintrecognition sensor 102 circuit is relatively rectangular, with theeffect of being able to sense an a two dimensional (2D) image of theuser's fingerprint. However, in alternative embodiments, the fingerprintrecognition sensor 102 circuit can be disposed on another shape, such asa circular or hexagonal shape which might also be suited to receiving 2Dfingerprint image information.

As described below, the fingerprint recognition sensor 102 includes asilicon wafer 308 onto which a fingerprint recognition circuit isdisposed, the fingerprint recognition circuit being electrically coupledto other elements of the device 100. The fingerprint recognition circuitis disposed relatively close to the user's finger, with the effect thatthe fingerprint recognition circuit can collect fingerprint imageinformation in response to the ridges and valleys of the user's fingerin response to measures of capacitance at each point on the user'sfinger. Electrical coupling between the fingerprint recognition circuitand other elements of the device 100 is further described below.

As described above, while this application primarily describes anassembly in which the fingerprint recognition sensor 102 circuit isdisposed for capacitive coupling to the epidermis of the user's finger,in the context of the invention, there is no particular requirement forany such limitation. For example, the fingerprint recognition sensor 102circuit might be capacitively coupled, or otherwise electromagneticallycoupled, to a subdermal portion of the user's finger. Moreover, thefingerprint recognition sensor 102 circuit might work in combination orconjunction with elements which perform optical sensing, infraredsensing, or other sensing of the user's fingerprint, and whichthemselves might be coupled either to the epidermis of the user'sfinger, to a subdermal portion of the user's finger, or to some otherfeature representative of the user's fingerprint.

In one embodiment, the fingerprint recognition sensor 102 includes anintegrated circuit, including one or more capacitive plates arranged ina two dimensional (2D) array, each such capacitive plate disposed forcollecting at least some fingerprint image information in response tothe ridges and valleys of the user's finger at one or more pixels in anarray thereof. This has the effect that, while each capacitive platecollects one or more pixels of fingerprint image information in an arraythereof, the set of those capacitive plates collectively receives a 2Darray of fingerprint image information. For example, a 2D array offingerprint image information can be used to determine substantialfeatures of the user's fingerprint, which can be used to enroll theuser's fingerprint in a database for later use, or which can be comparedat a later time against enrolled fingerprint image information torecognize the user's fingerprint and possibly to authenticate the userin response to that fingerprint image information.

The fingerprint recognition circuit is disposed above and coupled to aflexible element 116, the flexible element 116 being disposed both toreceive any force imposed by the user's finger on the button 104, and totransmit that force to a tactile dome switch 118 (as further describedbelow). The flexible element 116 is also disposed to receive electricalsignals (such as representing fingerprint image information) from thefingerprint recognition sensor 102, and transmit those electricalsignals from the fingerprint recognition sensor 102 to a processor.

The flexible element 116 is disposed above and coupled to a tactile domeswitch 118, which receives any force imposed by the user's finger on thebutton 104, transmits an electrical signal representing the user'sfinger having pushed the button 104 to a push button circuit, andoptionally provides tactile feedback to the user's finger to indicatethat the button 104 has been pushed.

As further described herein, disposing the tactile dome switch 118 in acolumn with the fingerprint recognition sensor 102 circuit has theeffect that the user's fingerprint can be recognized when the userpositions their finger on the button 104. For example, the user mightposition their finger on the button 104 as part of a power-on orstart-up sequence for the device 100, at which time the device 100 mightconcurrently both (A) act on the power-on or start-up sequence, and (B)receive fingerprint image recognition with respect to the user's finger,such as for enrollment or authentication of the user.

The tactile dome switch 118 is disposed above and coupled to a switchgasket 120, which holds the tactile dome switch 118, and which is heldin place by a button support plate 122. The button support plate 122 iscoupled to the base plate, and held in place by one or more verticalscrews. As described above, the base plate is also held in place withthe cover glass frame 106 by the one or more horizontal screws. In oneembodiment, the base plate also has other elements, such as holes forinterfacing other device elements, such as a microphone jack or otherelements.

After reading this application, those skilled in the art would recognizethat this particular disposition of the assembly as described is notabsolutely required, and that many variants thereof would be workableand would be within the scope and spirit of the invention, and would notrequire further invention or undue experiment.

In one particular, the positioning of the fingerprint recognition sensor102 circuit in relatively vertical alignment with the tactile domeswitch 118 allows the device 100 to combine the functions of receivingfingerprint image information and button-push information concurrently.

FIG. 2

FIG. 2 shows a conceptual drawing of a button assembly 200, showing thelaminated layers, as partially described with respect to FIG. 1.

The button assembly 200 as described with respect to FIG. 1 includes thelens 112, as described above, with a recessed shape formed at least inpart by a portion of the lens 112 to guide the user's finger onto thebutton 104. As described above, the lens 112 is disposed within theground ring 114, which optionally includes a button flange 115surrounding the sides of the button 104. In one embodiment, the buttonflange 115 can also cause a portion of the recessed shape to be formedat least in part by the button flange 115, again for the purpose ofguiding the user's finger onto the button 104.

An ink assembly, in one embodiment including 2-5 layers of ink 202, isdisposed below the lens 112. In one embodiment, the ink assembly can beprinted on the lens 112, vapor deposited thereon, or applied by anothertechnique. This has the effect that the otherwise-translucent button 104can be made opaque, so the elements of the fingerprint recognitionsensor are not immediately visible to the user. The lens 112 is coupledat its edges to the ground ring 114 using a heat activated film and aperimeter sealant 204.

As described above, the fingerprint recognition sensor circuit isdisposed below the lens 112. A liquid lamination layer 206 is disposedbelow the lens 112 with which to couple the fingerprint recognitionsensor circuit. The fingerprint recognition sensor circuit includes asilicon package 208, including a silicon circuit layer, solder (as shownin further detail below), and underfill 210 (as shown in further detailbelow).

As further described herein, the fingerprint recognition sensor circuitexhibits capacitive coupling with the ridges and valleys of the user'sfinger, such as at the epidermis of the user's finger, with the effectthat the fingerprint recognition sensor receives 2D fingerprint imageinformation, from which the device can determine whether the fingerprintis the user's fingerprint or some other person's fingerprint. As notedabove, the fingerprint recognition sensor circuit might also or insteadexhibit capacitive coupling with another portion of the user's finger,such as a subdermal layer thereof, or with another feature of the user'sfinger.

As described above, the fingerprint recognition circuit is disposedabove and coupled to a flexible element 116. The flexible element 116 iscoupled to a stiffener element 212. The edges of the ground ring 114which holds the lens 112 are coupled using a liquid adhesive 214 to thestiffener element 212. The stiffener element is disposed above andcoupled to a high-strength bonding tape, such as VHB tape 216, which isin turn disposed above and coupled to a flexible element 117 and to thetactile switch (button switch) 218.

After reading this application, those skilled in the art would recognizethat the assembly as described provides the fingerprint recognitionsensor with relatively lesser distance to the user's finger, andrelatively lesser stacking height, while concurrently allowing the userto access a push button or other element of the device using thefingerprint recognition sensor, without further invention or undueexperiment.

In a first particular, the assembly as described above includes arecessed shape with the effect that the user's finger is guided to aposition where the fingerprint recognition sensor can have superioreffect. The recessed shape is formed at least in part by a portion ofthe shape of the button 104, including the lens 112 and (optionally) bya portion of the shape of the ground ring 114. As described above, thefingerprint recognition sensor is disposed below the button 104, withthe effect that, when the user's finger is guided into the recessedshape, the user's finger is well positioned for fingerprint recognition.

In a second particular, the assembly as described above includes atactile push button at the bottom of the stack of elements, with theeffect that the fingerprint recognition sensor can have superior effectin response to being positioned relatively closer to the epidermis ofthe user's finger, while concurrently the user can use the push buttonand also have tactile feedback effect from pushing or releasing thatpush button. As described herein, disposition of the push button in asubstantially vertical stack with the fingerprint recognition sensorcircuit both (A) allows the device to accept a push button operationfrom the user, and concurrently perform fingerprint recognition on theusers finger which is pushing the button 104, and (B) allows the deviceto exhibit relatively superior capacitive coupling between thefingerprint recognition sensor circuit and the user's finger, withoutdisposing either the push button or the fingerprint recognition sensorcircuit too far from the user's finger.

FIG. 3

FIG. 3 shows another conceptual drawing of a button assembly 200,showing the fingerprint recognition sensor, as partially described withrespect to FIG. 1.

A set of ridges and valleys 302 of the user's fingerprint are showndisposed above the button assembly 200, with the ridges and valleys 302having the property that ridges of the user's fingerprint are relativelycloser to the external surface of the button 104, while valleys of theuser's fingerprint are relatively farther away from the external surfaceof the button 104. As described above, the fingerprint recognitionsensor circuit exhibits capacitive coupling with the ridges and valleys302 of the user's finger, such as at the epidermis of the user's finger304, with the fingerprint recognition sensor circuit being positionedrelatively close to the epidermis of the user's finger 304.

FIG. 3 similarly shows the button assembly 200 as described with respectto FIG. 1, including a recessed shape 306 formed at least in part by aportion of the shape of the lens 112, to guide the user's finger 304onto the button 104, and including the structure for ground ring 114,optionally also including a portion of the recessed shape 306, again toguide the user's finger 304 onto the button 104. FIG. 3 similarly showsthe ink assembly disposed below and coupled to the lens 112, with theeffect that the otherwise-translucent button 104 is made opaque, so theelements of the fingerprint recognition sensor are not immediatelyvisible to the user. FIG. 3 similarly shows the fingerprint recognitionsensor disposed below and coupled to the lens 112.

The fingerprint recognition sensor includes a silicon wafer 308,imprinted with a circuit 310 for measuring a capacitance between, on theone hand, one or more capacitive plates, and on the other hand, theuser's fingerprint (such as the ridges and valleys 302 on the epidermisof the user's finger 304), with the effect of providing fingerprintimage information with respect to ridges and valleys 302 of the user'sfinger 304. The ground ring 114 provides electrical isolation, with theeffect that the capacitance that is measured is between the user'sfinger 304 and the fingerprint recognition sensor, not between any otherobject and the fingerprint recognition sensor. The ground ring 114 maybe formed adjacent or near the lens 112 of the button 104. As oneexample, the ground ring 114 may be incorporated into, or formed on aside of, a structure 312 for supporting or integrating the ground ring114, such as a button flange 115.

In one embodiment, the silicon wafer 308 includes one or morethrough-silicon vias (TSVs), disposed to provide an electricalconnection between, on the one hand, the circuitry 310 disposed on a topof the silicon wafer 308, and on the other hand, circuitry disposedeither below or to the side of the silicon wafer. This has the effectthat bonding wires 314 need not be arced up from the surface of thesilicon wafer 308 to connect circuitry 310 from the silicon wafer 308 toelsewhere.

Using bonding wires 314 arcing up from the surface of the silicon wafer308 would otherwise occupy vertical space between the silicon wafer 308and the object next above the silicon wafer 308. Using through-siliconvias to connect the circuitry 310 disposed on the top of the siliconwafer 308 to another location (such as circuitry at the bottom of thesilicon wafer 308, or circuitry to the side of the silicon wafer 308)has the effect that a lesser amount of vertical space is needed for thefingerprint recognition sensor, with the effect that the fingerprintrecognition sensor can be placed closer to the user's finger 304 and canhave relatively better resolution and effectiveness.

In one embodiment (possibly used concurrently with embodiments havingthrough-silicon vias), the silicon wafer 308 includes one or more edgetrenches 316, that is, trenches etched or dug through the silicon wafer308 from, on the one hand, the circuitry 310 disposed on the top of thesilicon wafer 308, to on the other hand, circuitry disposed to a side ofthe silicon wafer 308. This also has the effect that bonding wires 314need not be arced up from the surface of the silicon wafer 308 toconnect circuitry 310 from the silicon wafer to elsewhere. As describedabove, reducing the need to arc bonding wires 314 up from the surface ofthe silicon wafer 308 reduces the amount of vertical space neededbetween the user's finger 304 and the fingerprint recognition sensor.

In one embodiment (again, possibly used concurrently with otherembodiments described above), the silicon wafer 308 is constructed bymeans of encapsulation in a plastic resin or other elastomeric material(or alternatively, in a ceramic), followed by removal of a top portionof the plastic resin or elastomer to the point where the wiring of thecircuit 310 disposed on the top of the silicon wafer 308 is nearlyexposed, or alternatively. just barely exposed. This has the effect thatthe fabricated silicon wafer 308 uses as little vertical space asreasonably possible, as there is a relatively limited amount of extravertical space used by wafer packaging for the finger recognitionsensor.

In one embodiment. the silicon wafer 308 is constructed including a setof solder balls 318 which are randomly (or pseudo-randomly) disposedcoupled to the wafer 308. Optionally, the solder balls 318 need notinclude actual solder, but may include other electrically conductivematerial, such as gold, other deformable metals, or other electricallyconductive or semiconductive material which can be deformed in responseto a physical process such as pressure. The solder balls 318 can beencapsulated in a plastic resin, followed by compression of the layer ofsolder balls 318 and plastic resin to the point where the solder balls318 and plastic resin are compressed. This has the effect that theplastic resin is substantially squeezed away from the solder balls 318,and the solder balls 318 are disposed to conduct electrical signalsbetween the silicon wafer 308 and other elements, such as the button104. As the solder balls 318, or other material, are dispersedhorizontally in their layer, this also has the effect that their layeroperates to conduct from a layer above to a layer below, without anyconduction horizontally across or within their layer.

In those cases in which the silicon wafer 308 is coupled to the button104, this has the effect that conduction is increased between thecapacitive plates of the silicon wafer 308 and the surface of the button104. This in turn has the effect that the capacitance between the user'sfinger 304 and the silicon wafer 308 is increased, due to reduceddistance between the epidermis of the user's finger 304 and the siliconwafer 308. This in turn allows the fingerprint recognition sensor toachieve superior capacitance sensing of the user's fingerprint imageinformation.

FIGS. 4A AND 4B

FIGS. 4A and 4B show another conceptual drawing of a button assembly200, showing the fingerprint recognition sensor, as partially describedwith respect to FIG. 1.

FIGS. 4A and 4B show both (FIG. 4A) a side cut-away view of the button104 and fingerprint recognition sensor, and (FIG. 4B) a top view of thefingerprint recognition sensor silicon wafer 308.

As described above, the button 104 includes a lens 112 (which may beconstructed from a variety of materials, such as glass, aluminum oxide,plastic, resins and the like), having a recessed shape 306 to guide theuser's finger onto the button 104. As described above, the lens 112 isdisposed within the ground ring 114 (for example, constructed ofanodized aluminum, such as SOS aluminum). As described above, the groundring 114 provides electrical isolation, with the effect that thecapacitance that is measured is between the user's finger and thefingerprint recognition sensor, not between any other object and thefingerprint recognition sensor.

The ground ring 114 is shown in the figure as having a cylindrical edgewhich holds the lens 112, and a base plate which can be aligned ororiented within the device when the assembly is constructed. Inalternative embodiments, instead of a ground ring 114, one or morecapacitive plates may be disposed at a side of the user's finger, withthe effect of providing capacitive isolation, so that any capacitivecoupling that occurs is only between the user's finger and thefingerprint recognition sensor. For example, capacitive plates may bedisposed surrounding a region in which the fingerprint recognitionsensor is located, with the effect of surrounding the fingerprintrecognition sensor with capacitive isolation. Similarly, capacitiveplates may be disposed near or inside a casing for the device, such as acasing for a smartphone or other device, also with the effect ofsurrounding the fingerprint recognition sensor with capacitiveisolation.

As described above, disposed below and coupled to the lens 112 is alayer of ink 202.

In one embodiment, the fingerprint recognition sensor includes a set ofcapacitive plates, disposed in a 2D array including pixels having adensity of approximately 300 dots per inch (dpi) or thereabouts (oroptionally, a greater or lesser density), with the effect of providing2D fingerprint image information with respect to the user's finger. Inone embodiment, the 2D fingerprint image includes a set of grayscalevalues, one or more such values for each pixel, with the effect ofproviding a 2D set of grayscale values to be sent to a processor forfingerprint recognition.

As described above, the one embodiment, the silicon wafer 308 assemblyis constructed including a set of solder balls 318 which are randomly(or pseudo-randomly) disposed coupled to the wafer 308 and encapsulatedin a compressed layer of plastic resin. Even when randomly orpseudo-randomly disposed, the set of solder balls 318 provides asubstantially even measure of electrical connectivity between thesilicon wafer 308 and other circuitry, such as the flexible element 116or 117, or both, described below.

As shown in the figures, the solder balls 318, or other material, can bedisposed in one or more of: (A) a layer above the silicon wafer 308,with the effect that the silicon wafer 308 is electrically coupled atleast in part to that layer there-above, (B) a layer below the siliconwafer 308, with the effect that the silicon wafer 308 is electricallycoupled at least in part to that layer there-below.

As described above, a flexible element 116 or 177 is coupled to thesilicon wafer 308, with the effect that the silicon wafer 308 can bepressed down when the button 104 is pressed, without substantial risk tothe structure of the wafer 308. The figure shows a set of connectorsbetween the flexible element 116 or 117 and the silicon wafer 308, withthe effect that when the button 104 is pressed down, the flexibleelement 116 or 117 flexes, causing the wafer 308 to be depressed withoutstructural strain.

As described above, a support plate 122 is positioned below and coupledto the wafer 308. A dome structure is positioned below and coupled tothe support plate 122, providing a tactile response to the user when thebutton 104 is pushed.

FIG. 5

FIG. 5 shows a conceptual drawing showing a relationship between abutton assembly 200 and a fingerprint recognition sensor 102.

In one embodiment, the button 104 includes an element including amaterial as described above, such as treated glass or sapphire, forming,at least in part, a recess-shaped indentation to guide the user's fingertoward a central location where best use can be made of the fingerprintrecognition sensor circuit. For example, as shown in the figure, aportion of the device 100 relatively closer to the user can include arelatively larger button element (shown as a horizontally-orientedrectangle), which overlays a relatively recess-shaped indentation (shownas a dotted circle), which overlays a fingerprint recognition sensorcircuit (shown as a square approximately the same size as the dottedcircle). This has the effect that the user can easily locate thefingerprint recognition sensor circuit by feel or touch, and can easilyorient their finger with respect to the fingerprint recognition sensorcircuit. This also has the effect that the fingerprint recognitionsensor circuit can be made substantially larger than it would be ifrequired to fit inside a circular ground ring surrounding the pushbutton, as the user's finger is relatively well positioned with respectto the fingerprint recognition sensor.

In one embodiment, there is no particular requirement for a specificground ring. The device 100 can include capacitive plates or groundingelements which are positioned to the sides of the fingerprintrecognition sensor circuit, with the effect that the fingerprintrecognition sensor circuit exhibits capacitive isolation, and with theeffect that the fingerprint recognition sensor circuit has capacitivecoupling to the epidermis of the user's finger, rather than to someoutside electromagnetic source of interference. For example, the device100 can include capacitive plates or grounding elements in one or moreof (A) directly to the sides of the fingerprint recognition sensorcircuit, positioned inside the device 100 and near the push button, (B)on the sides of the device housing, or a sub-housing including the pushbutton, or (C) otherwise positioned on or in the device housing, or asub-housing including the push button.

In one embodiment, there is no particular requirement for a physicaltactile sensor, such as a spring or other tactile element, for the pushbutton. For example, the device 100 can include one or more sensorscapable of determining whether the user is pressing on the cover glass107 (such as whether the user is pressing on the cover glass 107 in arecessed depression indicating where to press). As described above, therecessed depression indicating where to press also helps to position theuser's finger above the fingerprint recognition sensor circuit.

In a first example, the device 100 can include one or more sensorscapable of determining whether the user is pressing on the cover glass107 by measuring a ratio of area of the user's fingerprint area touchingthe glass. Such sensors can be responsive to an area of the cover glass107 obscured by the user's fingerprint, with the effect that when theuser is pressing harder on the cover glass 107, the area covered by theuser's finger would change from a relatively small dot (when barelytouching) to a relatively larger area (when pressing harder) to arelatively maximal area (when the user's finger is substantiallycompletely pressed against the cover glass 107).

In a second example, the device 100 can include one or more sensorscapable of determining whether the user is pressing on the cover glass107 by measuring a ratio of ridges of the user's fingerprint areatouching the glass (or otherwise disposed relatively near the glass).Such sensors can be responsive to a number of ridges of the user'sfingerprint, with the effect that when the user is pressing harder onthe cover glass 107, the number of ridges of the user's fingerprintwould change from a relatively small number (when barely touching) to arelatively larger number (when pressing harder) to a relatively maximalnumber (when the user's finger is substantially completely pressedagainst the cover glass 107).

In a third example, the device 100 can include one or more sensorscapable of determining whether the user is pressing on the cover glass107 using a strain gauge, with optional compensation for temperature.Such sensors can measure a relative amount of strain on the cover glass107 from pressure by the user's finger, with the effect that when theuser is pressing harder on the cover glass 107, the amount of strainwould change from a relatively minimal value (when barely touching) to arelatively larger value (when pressing harder) to a relatively maximalvalue (when the user's finger is substantially completely pressedagainst the cover glass 107).

In some embodiments, a rigid substrate may be used in addition to, orinstead of, the flexible element 116. In such embodiments, a sensor maybe attached to the rigid substrate and placed beneath the lens. Atactile switch, or other pressure-sensitive feedback device, may beattached to the underside of the rigid substrate. Alternately, thepressure-sensitive feedback device or switch may be mounted with itsunderside down to another circuit element, such as another rigidsubstrate, while the first rigid substrate serves as a bottom supportplate.

In one embodiment, the fingerprint recognition sensor circuit can takeadvantage of one or more electrical characteristics of the button 104,such as an anisotropy of the button material (such as an aluminum oxide,sapphire or another anisotropic material), to allow the fingerprintrecognition sensor circuit to better sense the epidermis of the user'sfinger (or optionally, a subdermal portion of the user's finger). Thishas the effect that the fingerprint recognition sensor circuit wouldexhibit relatively superior capacitive coupling to the user's finger byvirtue of the anisotropy of the button material, with the effect thatthe fingerprint recognition sensor circuit would obtain a relativelysuperior set of fingerprint image information. Similarly, whereapplicable, the fingerprint recognition sensor circuit can make use ofother electromagnetic properties of the button material to exhibitrelatively superior capacitive coupling to the user's finger by virtueof those other electromagnetic properties of the button material.

It should be appreciated that anisotropic dielectric materials may beused to form one or more layers above the capacitive sensor, such as acover glass 107 or button surface layer. Anisotropic dielectrics mayreduce blurring that is otherwise introduced by distance between acapacitive fingerprint sensor array and a finger's surface (orsubsurface). For example, orienting a sapphire layer covering orextending between the finger and capacitive sensor array may enhanceimaging. The sapphire layer may be oriented such that one of its axesperpendicular to its C-plane (such as the M-plane and A-plane) extendsbetween the sensor imaging array and the surface to be contacted by, ornear, a finger that is to be imaged. Generally, sapphire axesperpendicular to the C-plane may have a higher dielectric constant thandirections parallel to the C-plane and thus enhance capacitive sensingand/or imaging. Although either mono-crystalline or polycrystallinesapphire may be used in various embodiments, certain embodiments mayspecifically employ mono-crystalline sapphire. FIG. 7 generally shows asample crystal lattice structure 700 for sapphire, with the criticalplane 702 (in this case, the C-plane) oriented as a top surface.

In one embodiment, the fingerprint recognition sensor circuit caninclude elements which are coupled to the button 104, with the effectthat the fingerprint recognition sensor circuit can take advantage ofadditional physical and electrical characteristics of the button 104.

For a first example, the fingerprint recognition sensor circuit caninclude circuit elements which are printed on a surface of the button104, such as a bottom surface positioned away from the user's finger andthus relatively immune from damage.

For a second example, the fingerprint recognition sensor circuit caninclude circuit elements which are deposited on a surface of the button104. In such examples, those circuit elements can be deposited usingetching, sputtering, or other techniques for integrating semiconductorcircuits onto the surface of a relatively non-conducting surface.

In one embodiment, the fingerprint recognition sensor circuit can beassisted by an optical element, such as one which uses a transparentcharacteristic of the button 104. For example, an optical element canobtain an optical view of the epidermis of the user's finger (whetherdetermined as a still picture, as a sequence of still pictures, or as avideo sequence). In one example, that optical view could be processedwith respect to optical differences detected between the ridges andvalleys of the user's finger, such as any shadowing differences thatmight be present. Shadowing differences could be present due to ambientlight, or due to an optical (or optionally, infrared or anotherapplicable electromagnetic frequency) source from within the device 100.

In one embodiment, the fingerprint recognition sensor circuit can beassisted by an infrared sensing element, such as one which uses atransparent or translucent characteristic of the button 104. Forexample, an infrared sensing element can obtain an infrared view of theepidermis of the user's finger or a subdermal portion of the user'sfinger (whether determined as a still picture, as a sequence of stillpictures, or as a video sequence). In one example, that infrared viewcould be processed with respect to infrared differences detected betweenthe ridges and valleys of the user's finger, such as any temperaturedifferences or infrared frequency differences that might be present.Temperature differences or infrared frequency differences could bepresent due to an internal temperature of the user's finger, or due toan optical, infrared, or other applicable electromagnetic frequency,source from within the device 100.

In such examples, the capacitive coupling between the fingerprintrecognition sensor circuit and the epidermis of the user's finger, andany optical information or infrared information, could be combined toform a unified set of fingerprint image information. Alternatively, insuch examples, the capacitive coupling between the fingerprintrecognition sensor circuit and the epidermis of the user's finger, andany optical information or infrared information, could be processedseparately to recognize the user's fingerprint, with one or more thereofbeing required, or optionally weighted, to achieve recognition of theuser's fingerprint.

Certain aspects of the embodiments described in the present disclosuremay be provided as a computer program product, or software, that mayinclude, for example, a computer-readable storage medium or anon-transitory machine-readable medium having stored thereoninstructions, which may be used to program a computer system (or otherelectronic devices) to perform a process according to the presentdisclosure. A non-transitory machine-readable medium includes anymechanism for storing information in a form (e.g., software, processingapplication) readable by a machine (e.g., a computer). Thenon-transitory machine-readable medium may take the form of, but is notlimited to, a magnetic storage medium (e.g., floppy diskette, videocassette, and so on); optical storage medium (e.g., CD-ROM);magneto-optical storage medium; read only memory (ROM); random accessmemory (RAM); erasable programmable memory (e.g., EPROM and EEPROM);flash memory; and so on.

FIG. 6 shows another conceptual drawing of a button assembly 200,showing the fingerprint recognition sensor, as partially described withrespect to FIG. 1.

FIG. 6 similarly shows the button assembly 200 with a substantially flator planar lens 112, which may be slightly recessed with respect to thecover glass 107 of an electronic device such as device 100, as describedwith respect to FIG. 1. In this design the lens 112 has a flat shape 307formed at least in part by a portion of the shape of the lens 112, toaccommodate the user's finger onto the button 104, including thestructure for ground ring 114, optionally also including a portion ofthe flat shape 307, in either a flush, slightly recessed, or slightlyproud arrangement with respect to lens 112. FIG. 3 similarly shows thefingerprint recognition sensor disposed below and coupled to the lens112.

While the present disclosure has been described with reference tovarious embodiments, it will be understood that these embodiments areillustrative and that the scope of the disclosure is not limited tothem. Many variations, modifications, additions, and improvements arepossible. More generally, embodiments in accordance with the presentdisclosure have been described in the context of particular embodiments.Functionality may be separated or combined in procedures differently invarious embodiments of the disclosure or described with differentterminology. These and other variations, modifications, additions, andimprovements may fall within the scope of the disclosure as defined inthe claims that follow.

1-98. (canceled)
 99. An electronic device, comprising: a cover layercomprising an opening; a display positioned below the cover layer; astructure positioned adjacent to the display and within the opening; andan input device, comprising: a top element positioned within the openingand surrounded by the structure; a fingerprint sensor positioned belowthe top element; a flexible circuit positioned below and electricallyconnected to the fingerprint sensor; and a stiffener positioned belowthe flexible circuit and affixed to the structure.
 100. The electronicdevice of claim 99, wherein: the flexible circuit comprises a firstflexible circuit; and the input device further comprises: a secondflexible circuit positioned below the stiffener; and a control elementpositioned below and electrically connected to the second flexiblecircuit, the control element responsive to a pressure applied to thebutton.
 101. The electronic device of claim 100, wherein the secondflexible circuit is electrically connected to the first flexiblecircuit.
 102. The electronic device as in claim 99, wherein the topelement is comprised of a sapphire material having a planar axisperpendicular to a C-plane of the sapphire material, the planar axisextending between the fingerprint sensor and a top surface of the topelement.
 103. The electronic device as in claim 99, wherein thefingerprint sensor comprises a sensor circuit electrically connected toone or more bonding wires disposed through one or more edge trenchesformed in a wafer.
 104. The electronic device as in claim 99, wherein atleast a portion of a top surface of the top element is recessed withrespect to the cover layer.
 105. The input device as in claim 99,wherein the top element is recessed at least partially by a chamfer inthe structure.
 106. The input device as in claim 99, wherein the topelement has a substantially flat top surface.
 107. The electronic deviceas in claim 99, wherein the structure electrically isolates thefingerprint sensor.
 108. The electronic device as in claim 99, whereinthe cover layer is comprised of a sapphire material.
 109. An inputdevice, comprising: a button; a fingerprint sensor positioned below thebutton; a flexible circuit positioned below and electrically connectedto the fingerprint sensor; a stiffener positioned below the flexiblecircuit; and a layer of electrically conductive material positionedbetween at least one of: the fingerprint sensor and the flexible circuitand configured to conduct signals between the fingerprint sensor and theflexible circuit; or the button and the fingerprint sensor andconfigured to conduct signals between the button and the fingerprintsensor.
 110. The input device of claim 109, wherein: the flexiblecircuit comprises a first flexible circuit; and the input device furthercomprises: a second flexible circuit positioned below the stiffener; anda control element positioned below and electrically connected to thesecond flexible circuit, the control element responsive to a pressureapplied to the button.
 111. The input device of claim 110, wherein thecontrol element comprises a switch.
 112. The input device of claim 111,further comprising: a switch gasket positioned below the switch andconfigured to support the switch; and a support plate positioned belowthe switch gasket and configured to support the switch gasket.
 113. Theinput device as in claim 109, wherein the button is comprised of asapphire material having a planar axis perpendicular to a C-plane of thesapphire material, the planar axis extending between the fingerprintsensor and a top surface of the button.
 114. The input device as inclaim 109, wherein at least a portion of a top surface of the button isrecessed with respect to the cover layer.
 115. The input device as inclaim 109, wherein a top surface of the button is substantially flatwith respect to the cover layer.
 116. The input device as in claim 109,wherein the fingerprint sensor comprises a sensor circuit electricallyconnected to one or more bonding wires disposed through one or more edgetrenches formed in a wafer.
 117. The input device as in claim 109,wherein the layer of electrically conductive material is encapsulated ina resin.
 118. The input device as in claim 109, wherein the layer ofelectrically conductive material comprises a layer of solder balls. 119.The input device of claim 109, wherein the fingerprint sensor comprisesa capacitive fingerprint sensor.